RRP Semiconductor Ltd. has entered the fabless semiconductor market. The company completed an IP transfer of Application-Specific Integrated Circuit (ASIC) design from its European partners. This step allows RRP to design and develop semiconductor solutions independently.
The transfer includes the full ASIC design workflow. RRP now offers services ranging from front-end design to back-end integration. The company will also handle wafer production. It aims to provide customised chips for the automotive sector, which currently relies heavily on imports.
RRP expects to generate between $25 million and $100 million in revenue within the next two years. The global ASIC market is projected to exceed $30 billion by 2031, presenting significant growth opportunities.
RRP’s experience in outsourced semiconductor assembly and testing (OSAT) facilities strengthens its market position. The company’s expanded capabilities will offer tailored solutions in semiconductor design.
To support this move, RRP will conduct workshops and case studies focused on advanced design techniques. This expansion positions the company as a leader in semiconductor innovation.
